AceAxis developed a test system to analyze the digital bitstream (I/Q data) on the fiber interface between the BBU and RRH (Remote Radio Head) to measure the effects of Passive Intermodulation (PIM). Together with our distribution partner 4Most, nVent SCHROFF delivered several cases for this single board solution.
The cases had to accommodate a customer-specific form factor; thus, no standard case was available on the market. Also, the customer had the following requirements:
- EMC shielding included
- Integration of custom-developed rubber frames to ensure a firm grip even when the enclosures are stacked or placed on a table
- Compact case solution, with a maintenance-free conduction cooling concept for a higher thermal performance
nVent uses the existing Interscale case concept for shortening the development time for a non-standard case. This allows easy adaptation to the case design, and EMC protection is guaranteed thanks to a unique locking mechanism of the side panels. The rubber frame assembly is screwless and easy to remove. For the case with higher heat dissipation, a heat sink with a thermal pad to the processor was used to increase the cooling performance. Each case is painted according to the customer’s requirements.